R&D Director, RF Front-End Chip

Job Description Responsible for RF front-end chip (PA, LNA, switch, filter) technical roadmap, product definition and full R&D lifecycle management. Lead chip architecture design, circuit development, tapeout and post-silicon tuning to achieve mass-production quality and performance. Oversee R&D project delivery, process standardization and cross-department collaboration. Manage, build and mentor the RFIC R&D team, drive technical innovation and patent layout, and support customer technical solutions. Job Requirements Master/PhD in Microelectronics or RF Engineering. 12+ years RF IC design experience with 5+ years senior management experience. Experienced in RF front-end chip mass production, proficient in IC design flow, EDA tools and CMOS/SOI/SiGe processes. Familiar with 5G/Wi-Fi/IoT wireless standards. Strong leadership and project management skills. Fluent in English for international working environment.